Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturised electronic devices and advanced packages. Among the broad range of topics covered are: ■advanced packaging ■ball grid array (BGA) ■ceramics ■chip attachment ■chip on board (COB) ■chip scale packaging (CSP) ■dieing ■land grid array (LGA) ■micro-circuit technology ■multichip modules (MCMs) ■scribing ■semiconductor technology ■thick/thin film technology
| YEAR | Impact Factor |
|---|---|
| 2023-24 | 0.7 |
| 2022 | 1.1 |
| 2021 | 0.942 |
MICROELECTRONICS INTERNATIONAL, 1356-5362, 1982-ongoing, Engineering,Materials Science,Physics and Astronomy.