The journal comprises a multidisciplinary study of the key technologies relating to the assembly of printed circuit boards (PCBs) and the interconnection of electronic components and other devices on the printed board. Among the broad range of topics covered are: ■surface mount technology (SMT) ■surface mount assembly ■soldering ■solders, pastes and fluxes ■screen printing and liquid deposition ■conductive adhesives ■conformal coatings ■inspection and test ■packaging and interconnection ■quality control ■rework and repair ■encapsulants ■cleaning ■environmental aspects
| YEAR | Impact Factor |
|---|---|
| 2023-24 | 1.7 |
| 2022 | NA |
| 2021 | 1.552 |
SOLDERING & SURFACE MOUNT TECHNOLOGY, 0954-0911, 1989-ongoing, Engineering,Materials Science,Physics and Astronomy.